Blind Watermarking for 3-D Printed Objects by Locally Modifying Layer Thickness

You are here

IEEE Transactions on Multimedia

Top Reasons to Join SPS Today!

1. IEEE Signal Processing Magazine
2. Signal Processing Digital Library*
3. Inside Signal Processing Newsletter
4. SPS Resource Center
5. Career advancement & recognition
6. Discounts on conferences and publications
7. Professional networking
8. Communities for students, young professionals, and women
9. Volunteer opportunities
10. Coming soon! PDH/CEU credits
Click here to learn more.

Blind Watermarking for 3-D Printed Objects by Locally Modifying Layer Thickness

By: 
Arnaud Delmotte; Kenichiro Tanaka; Hiroyuki Kubo; Takuya Funatomi; Yasuhiro Mukaigawa

We propose a new blind watermarking algorithm for 3D printed objects that has applications in metadata embedding, robotic grasping, counterfeit prevention, and crime investigation. Our method can be used on fused deposition modeling (FDM) 3D printers and works by modifying the printed layer thickness on small patches of the surface of an object. These patches can be applied to multiple regions of the object, thereby making it resistant to various attacks such as cropping, local deformation, local surface degradation, or printing errors. The novelties of our method are the use of the thickness of printed layers as a one-dimensional carrier signal to embed data, the minimization of distortion by only modifying the layers locally, and one-shot detection using a common paper scanner. To correct encoding or decoding errors, our method combines multiple patches and uses a 2D parity check to estimate the error probability of each bit to obtain a higher correction rate than a naive majority vote. The parity bits included in the patches have a double purpose because, in addition to error detection, they are also used to identify the orientation of the patches. In our experiments, we successfully embedded a watermark into flat surfaces of 3D objects with various filament colors using a standard FDM 3D printer, extracted it using a common 2D paper scanner and evaluated the sensitivity to surface degradation and signal amplitude.

SPS on Twitter

  • DEADLINE EXTENDED: The 2023 IEEE International Workshop on Machine Learning for Signal Processing is now accepting… https://t.co/NLH2u19a3y
  • ONE MONTH OUT! We are celebrating the inaugural SPS Day on 2 June, honoring the date the Society was established in… https://t.co/V6Z3wKGK1O
  • The new SPS Scholarship Program welcomes applications from students interested in pursuing signal processing educat… https://t.co/0aYPMDSWDj
  • CALL FOR PAPERS: The IEEE Journal of Selected Topics in Signal Processing is now seeking submissions for a Special… https://t.co/NPCGrSjQbh
  • Test your knowledge of signal processing history with our April trivia! Our 75th anniversary celebration continues:… https://t.co/4xal7voFER

IEEE SPS Educational Resources

IEEE SPS Resource Center

IEEE SPS YouTube Channel